LG has introduced a comprehensive end-to-end cooling solution to address the escalating demands of high-capacity data centers. The launch positions the brand as a key player in the rapidly expanding digital infrastructure sector.

As global data center capacity is projected to grow by nearly 20% annually through 2030, the strain on cooling infrastructure intensifies. LG’s new end-to-end thermal management system was unveiled at Data Center World 2025. It targets heat dissipation at every level — from individual chips to entire server rooms — while optimizing energy efficiency and minimizing operational disruptions. The innovation includes advanced cold plate technology for high-performance chips, a compact coolant distribution unit with predictive failure diagnostics, and an energy-efficient computer room air handler. The end-to-end cooling solution is engineered to enhance reliability and reduce downtime in mission-critical environments.

Image Credit: LG