LG Innotek has introduced a groundbreaking advancement in semiconductor substrate technology with its newly developed ‘copper post’ (or Cu-Post) innovation, which positions the company as a potential industry leader in high-performance mobile components.

The copper post technology represents a significant shift from traditional methods by replacing direct solder ball connections with copper posts. This approach enables denser circuitry, improved heat dissipation due to the superior thermal conductivity of the material, and more compact semiconductor designs. The key advantage lies in the innovation’s ability to accommodate up to 20% more solder balls on a substrate compared to conventional approaches. This advancement in high-performance mobile components addresses the growing demand for slimmer yet more powerful smartphones, particularly those optimized for AI computations.

Image Credit: LG Innotek